Editor

Yan Jin
Dept. of Aerospace and Mechanical Engineering
University of Southern California
3650 McClintock Avenue, OHE-430
Los Angeles, CA 90089-1453
USA
yjin@usc.edu

Associate Editor

Amaresh Chakrabarti
Indian Institute of Science, India
ac123@cpdm.iisc.ernet.in

Ashok K. Goel
Georgia Institute of Technology, USA
goel@cc.gatech.edu

Mary Lou Maher
University of Sydney, Australia
mary@arch.usyd.edu.au

Kristina Shea
Technische Universität München, Germany
kristina.shea@pe.mw.tum.de

Editorial Board

Alice M. Agogino
University of California, Berkeley, USA
aagogino@euler.berkeley.edu

Frances Brazier
Vrije Universiteit, Netherlands
frances@cs.vu.nl

David C. Brown
Worcester Polytechnic Institute, USA
dcb@cs.wpi.edu

Jonathan Cagan
Carnegie Mellon University, USA
cagan@cmu.edu

Matthew Campbell
University of Texas at Austin, USA
mc1@mail.utexas.edu

Per Christiansson
Aalborg University, Denmark
pc@civil.auc.dk

Ellen Do
Georgia Institute of Technology, USA
ellendo@gatech.edu

Andy Dong
University of Sydney, Australia
andy.dong@sydney.edu.au

Alex H.B. Duffy
University of Strathclyde, Scotland
alex@cad.strath.ac.uk

Boi Faltings
Ecole Polytechnique Fédérale, Switzerland
Boi.Faltings@epfl.ch

Donal Finn
University College, Dublin, Ireland
donal.finn@ucd.ie

John S. Gero
George Mason University, Fairfax, USA
john@johngero.com

Roderick A. Grupen
University of Massachusetts at Amherst, USA
grupen@cs.umass

Sean Hanna
University College London, UK
s.hanna@ucl.ac.uk

Mark Klein
Massachusetts Institute of Technology, USA
m_klein@mit.edu

John C. Kunz
Stanford University, USA
kunz@ce.stanford.edu

Jean-Claude Latombe
Stanford University, USA
latombe@cs.stanford.edu

Wolfgang Nejdl
Institut für Verteilte Systeme, Hannover, Germany
nejdl@kbs.uni-hannover.de

Panos Papalambros
University of Michigan, USA
pyp@caen.engin.umich.edu

H. Van Dyke Parunak
Altarum, USA
Van.Parunak@altarum.org

William C. Regli
Drexel University, USA
regli@drexel.edu

Warren Seering
Massachusetts Institute of Technology, USA
seering@mit.edu

Lily Shu
University of Toronto, Canada
shu@mie.utoronto.ca

Ian Smith
Ecole Polytechnique Fédérale, Switzerland
Ian.Smith@epfl.ch

Tim Smithers
University of Strathclyde, Scotland
tsmithers@acm.org

Robert Stone
Oregon State University, USA
rob.stone@oregonstate.edu

Rudi Stouffs
Delft University of Technology, Netherlands
r.m.f.stouffs@tudelft.nl

Markus Stumptner
University of South Australia, Australia
mst@cs.unisa.edu.au

Tetsuo Tomiyama
Delft University of Techology, Netherlands
t.tomiyama@wbmt.tudelft.nl

Jan H. Vandenbrande
The Boeing Company, USA
jan.h.vandenbrande@boeing.com